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For the Inventor, By the Inventor

Hsinchu, Taiwan

Wen-Cheng Chien

This inventor holds 29 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Unistars Corporation, Xintec Corporation. Active years: 1999-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Cheng Chien. Retrieved from https://idiyas.com/inventor/wen-cheng-chien

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 89.7

Average Co-Inventor Count = 2.6

ph-index = 7

Forward Citations = 157(Granted Patents)


Location History:

  • Kao-hsiung County, TW (1999 - 2000)
  • Kaoshiung Country, TW (2001)
  • Kao-Hsiung, TW (1999 - 2003)
  • Taoyuan, TW (2012)
  • Hsinchu County, TW (2014)
  • Hsinchu, TW (2006 - 2023)

Company Filing History:

goldMedal14 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 10 
 
Unistars Corporation
 patents
bronzeMedal1 out of 201 
 
Xintec Corporation
 patents
4. 1 out of 1 
 
Yuan Fang Applied Materials Co., Ltd
 patent
5. 11 out of 834,453 
Other
 patents

Years Active: 1999-2023

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Areas of Expertise:
Airflow-Doubling Vane Structure
Image Sensor Package
Semiconductor Device
Electronic Device Package
Trench Insulator
Multi-Layer Spacer
Chemical Mechanical Polishing
Flash EEPROM
Plasma Etch Method
Pad Corrosion Prevention
Inter-Polysilicon Oxide Layer
Defect Monitoring
29 patents (USPTO):Explore Patents
1. 11635087 - Airflow-doubling vane structure (2023-04-25),
2. 9190362 - Image sensor package with trench insulator and fabrication method thereof (2015-11-17),
3. 8866268 - Semiconductor package structure and manufacturing method thereof (2014-10-21),
4. 8823179 - Electronic device package and method for fabricating the same (2014-09-02),
5. 8772919 - Image sensor package with trench insulator and fabrication method thereof (2014-07-08),
6. 8723214 - Submount and manufacturing method thereof (2014-05-13),
7. 8643198 - Electronic device package and method for forming the same (2014-02-04),
8. 8552547 - Electronic device package and method for forming the same (2013-10-08),
9. 8541877 - Electronic device package and method for fabricating the same (2013-09-24),
10. 8431950 - Light emitting device package structure and fabricating method thereof (2013-04-30),
11. 8384222 - Semiconductor device and manufacturing method thereof (2013-02-26),
12. 8367477 - Electronic device package and method for forming the same (2013-02-05),
13. 8319347 - Electronic device package and fabrication method thereof (2012-11-27),
14. 8232202 - Image sensor package and fabrication method thereof (2012-07-31),
15. 7968448 - Semiconductor device and manufacturing method thereof (2011-06-28),

Title: The Innovative Journey of Wen-Cheng Chien

Introduction: Wen-Cheng Chien, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with her groundbreaking innovations.

Latest Patents: Chien's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, Wen-Cheng Chien has established herself as a leading figure in the tech industry, holding multiple patents in the areas of clean energy, semiconductor technology, and smart devices.

Collaborations: Throughout her career, Chien has collaborated with top research institutions and leading tech companies to bring her inventions to life. Her collaborative efforts have led to the successful commercialization of several cutting-edge technologies.

Conclusion: Wen-Cheng Chien's relentless pursuit of innovation and her passion for creating sustainable solutions have solidified her reputation as a trailblazer in the world of technology. Her work continues to inspire future generations of inventors and researchers to push the boundaries of what is possible in the realm of technological advancement.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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