The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2012

Filed:

May. 21, 2009
Applicants:

Chia-lun Tsai, Tainan, TW;

Wen-cheng Chien, Hsinchu, TW;

Po-han Lee, Taipei, TW;

Wei-ming Chen, Hsinchu, TW;

Inventors:

Chia-Lun Tsai, Tainan, TW;

Wen-Cheng Chien, Hsinchu, TW;

Po-Han Lee, Taipei, TW;

Wei-Ming Chen, Hsinchu, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/46 (2006.01); H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic device package and a fabrication method thereof are provided. The fabrication method includes providing a semiconductor substrate containing a plurality of chips having a first surface and an opposite second surface. A plurality of conductive electrodes is disposed on the first surface and the conductive electrodes of the two adjacent chips are arranged asymmetrically along side direction of the chip. A plurality of contact holes is formed in each chip, apart from the side of the chip, to expose the conductive electrodes.


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