The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2015
Filed:
Jul. 08, 2014
Xintec Inc., Jhongli, Taoyuan County, TW;
Wen-Cheng Chien, Hsinchu, TW;
Wen-Ken Huang, Hsinchu, TW;
Chien-Hung Liu, New Taipei, TW;
Joey Lai, Hsinchu, TW;
XINTEC INC., Taoyuan, TW;
Abstract
The invention provides a chip package and a fabrication method thereof. In one embodiment, the chip package includes: a substrate having a semiconductor device and a conductive pad thereon; an insulator ring filling a trench formed in the substrate, wherein the insulator ring surrounds an intermediate layer below the conductive pad; and a conductive layer disposed below a backside of the substrate and electrically connected to the conductive pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile