The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Jun. 13, 2008
Applicants:
Chia-lun Tsai, Tainan, TW;
Wen-cheng Chien, Hsinchu, TW;
Po-han Lee, Taipei, TW;
Wei-ming Chen, Hsinchu, TW;
Chien-hung Liu, Xindian, TW;
Ying-nan Wen, Taoyuan, TW;
Inventors:
Chia-Lun Tsai, Tainan, TW;
Wen-Cheng Chien, Hsinchu, TW;
Po-Han Lee, Taipei, TW;
Wei-Ming Chen, Hsinchu, TW;
Chien-Hung Liu, Xindian, TW;
Ying-Nan Wen, Taoyuan, TW;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 27/146 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 2924/3025 (2013.01); H01L 27/14618 (2013.01); H01L 27/14683 (2013.01); H01L 21/76898 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01021 (2013.01); H01L 2924/14 (2013.01); H01L 24/12 (2013.01);
Abstract
An embodiment of the present invention provides an electronic device package, which includes a chip having a first surface and an opposite second surface and a trench extending into a body of the chip along a direction from the second surface to the first surface, wherein a bottom portion of the trench includes at least two contact holes.