The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Jul. 15, 2011
Shang-yi Wu, Hsinchu County, TW;
Wen-cheng Chien, Hsinchu County, TW;
Chia-lun Tsai, Hsinchu County, TW;
Tien-hao Huang, Hsinchu County, TW;
Shang-Yi Wu, Hsinchu County, TW;
Wen-Cheng Chien, Hsinchu County, TW;
Chia-Lun Tsai, Hsinchu County, TW;
Tien-Hao Huang, Hsinchu County, TW;
Unistars Corporation, Zhudong Township, TW;
Abstract
A semiconductor package structure and a manufacturing method thereof are provided. The semiconductor package structure includes a semiconductor die, a thermally conductive film, a substrate, a plurality of electrically conductive film patterns, and at least one insulator. The thermally conductive film is disposed on the bottom of the semiconductor die. The substrate is substantially comprised of the electrically conductive material or semiconductor material. Furthermore, a first hole is disposed on and passed all the way through the substrate, and the semiconductor die is disposed in the first hole. The electrically conductive film patterns are disposed on the substrate, and not contacting with each other. In addition, the insulator is connected between the semiconductor die and the substrate.