The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2013
Filed:
May. 22, 2009
Chia-lun Tsai, Tainan, TW;
Ching-yu NI, Hsinchu, TW;
Wen-cheng Chien, Hsinchu, TW;
Shang-yi Wu, Hsinchu, TW;
Cheng-te Chou, Sijhih, TW;
Chia-Lun Tsai, Tainan, TW;
Ching-Yu Ni, Hsinchu, TW;
Wen-Cheng Chien, Hsinchu, TW;
Shang-Yi Wu, Hsinchu, TW;
Cheng-Te Chou, Sijhih, TW;
Other;
Abstract
A light emitting device package structure is described. The light emitting device package structure includes a substrate serving as a carrier supporting a light emitting device chip. The substrate and the light emitting device chip have a chip side and a substrate side separately. A first electrode layer is disposed on a first surface of the light emitting device chip and a second electrode layer is disposed on a second surface of the light emitting device chip, in which the first surface and the second surface are not coplanar. A first conductive trace is electrically connected to the first electrode layer and a second conductive trace is electrically connected to the second electrode layer. At least the first conductive trace or the second conductive trace is formed along the chip side and the substrate side simultaneously.