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For the Inventor, By the Inventor

Hsinchu, Taiwan

Ching-Yu Ni

This inventor holds 17 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Xintec Corporation, Other. Active years: 2006-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ching-Yu Ni. Retrieved from https://idiyas.com/inventor/ching-yu-ni

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 17

% Patents Active = 76.5

Average Co-Inventor Count = 2.9

ph-index = 4

Forward Citations = 45(Granted Patents)


Location History:

  • Shinchu, TW (2006 - 2008)
  • HsinChu, TW (2007 - 2017)

Company Filing History:

goldMedal3 out of 42,965 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 203 
 
Xintec Corporation
 patents
bronzeMedal12 out of 834,601 
Other
 patents

Years Active: 2006-2017

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Areas of Expertise:
Chip Package
Fabrication Method
Electronic Device
Power MOSFET
Semiconductor Device
Light Emitting Device
Passive Components
Manufacturing Method
3D Stacking
Thermal Management
Constraint Stiffener
Device Structure
17 patents (USPTO):Explore Patents
1. 9799588 - Chip package and manufacturing method thereof (2017-10-24),
2. 8822325 - Chip package and fabrication method thereof (2014-09-02),
3. 8766431 - Power MOSFET package (2014-07-01),
4. 8766400 - Electronic device containing passive components and fabrication method thereof (2014-07-01),
5. 8716109 - Chip package and fabrication method thereof (2014-05-06),
6. 8643198 - Electronic device package and method for forming the same (2014-02-04),
7. 8564123 - Chip package and fabrication method thereof (2013-10-22),
8. 8552547 - Electronic device package and method for forming the same (2013-10-08),
9. 8541877 - Electronic device package and method for fabricating the same (2013-09-24),
10. 8431950 - Light emitting device package structure and fabricating method thereof (2013-04-30),
11. 8410599 - Power MOSFET package (2013-04-02),
12. 8384222 - Semiconductor device and manufacturing method thereof (2013-02-26),
13. 8367477 - Electronic device package and method for forming the same (2013-02-05),
14. 7968448 - Semiconductor device and manufacturing method thereof (2011-06-28),
15. 7348218 - Semiconductor packages and methods of manufacturing thereof (2008-03-25),

Title: The Innovative Journey of Ching-Yu Ni

Introduction: Ching-Yu Ni is a pioneering inventor hailing from Hsinchu, Taiwan. Her groundbreaking work in the field of technology has left a lasting impact on the industry.

Latest Patents: Ching-Yu Ni holds several patents in the realm of semiconductor technology, with her most recent patent focusing on advanced nanoscale materials for electronic devices.

Career Highlights: With a career spanning over two decades, Ching-Yu Ni has worked with leading tech companies in Taiwan, contributing significantly to the development of cutting-edge technologies. Her expertise in semiconductor research has led to the creation of innovative solutions that have revolutionized the industry.

Collaborations: Throughout her career, Ching-Yu Ni has collaborated with top research institutions and universities to further her research and bring her inventions to life. Her collaborative efforts have resulted in the successful implementation of her patented technologies in real-world applications.

Conclusion: Ching-Yu Ni's dedication to innovation and her relentless pursuit of technological advancement have solidified her position as a trailblazer in the field of semiconductor technology. Her contributions continue to inspire future generations of inventors and researchers in Taiwan and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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