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For the Inventor, By the Inventor

Cupertino, CA, United States of America

Uday Mitra

This inventor holds 23 USPTO granted patents and 5 published patent applications, primarily in Semiconductor Fabrication. Top assignees: Micro Materials Inc., Applied Materials, Inc., Mirocmaterials LLC. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Uday Mitra. Retrieved from https://idiyas.com/inventor/uday-mitra

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 47.8

Average Co-Inventor Count = 5.1

ph-index = 3

Forward Citations = 29(Granted Patents)


Company Filing History:

goldMedal15 out of 27 
 
Micro Materials Inc.
 patents
silverMedal6 out of 14,433 
 
Applied Materials, Inc.
 patents
bronzeMedal2 out of 2 
 
Mirocmaterials LLC
 patents

Years Active: 2012-2026

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Areas of Expertise:
Epitaxial Growth
Self-Aligned Vias
Metal Oxide Etching
DRAM Capacitor Module
Barrier-Liner Recess
Etch Residue Reduction
High Aspect Ratio Vias
Semiconductor Device Fabrication
Nanometer Technology
Selective Removal Process
Spacer Patterning Schemes
Fully Self-Aligned Via
23 patents (USPTO):Explore Patents
1. 12538737 - Integrated wet clean for epitaxial growth (2026-01-27),
2. 11705366 - Methods for controllable metal and barrier-liner recess (2023-07-18),
3. 11437274 - Fully self-aligned via (2022-09-06),
4. 11232955 - Methods of etching metal oxides with less etch residue (2022-01-25),
5. 11164938 - DRAM capacitor module (2021-11-02),
6. 11062942 - Methods for controllable metal and barrier-liner recess (2021-07-13),
7. 11037825 - Selective removal process to create high aspect ratio fully self-aligned via (2021-06-15),
8. 10892187 - Method for creating a fully self-aligned via (2021-01-12),
9. 10892183 - Methods for removing metal oxides (2021-01-12),
10. 10790191 - Selective removal process to create high aspect ratio fully self-aligned via (2020-09-29),
11. 10699953 - Method for creating a fully self-aligned via (2020-06-30),
12. 10622221 - Methods of etching metal oxides with less etch residue (2020-04-14),
13. 10600688 - Methods of producing self-aligned vias (2020-03-24),
14. 10593594 - Selectively etched self-aligned via processes (2020-03-17),
15. 10573555 - Methods of producing self-aligned grown via (2020-02-25),

Title: The Innovative Journey of Uday Mitra

Introduction: Uday Mitra, a visionary inventor based in Cupertino, CA, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Uday Mitra's latest patents include a cutting-edge artificial intelligence algorithm for autonomous vehicles and a revolutionary wearable device for monitoring health metrics in real-time.

Career Highlights: With over two decades of experience in the tech industry, Uday Mitra has held key positions in leading tech companies, where he spearheaded research and development projects that have shaped the future of technology.

Collaborations: Uday Mitra has collaborated with top research institutions and universities worldwide to further his research and bring his innovative ideas to life. His collaborative efforts have resulted in several successful patents and inventions.

Conclusion: Uday Mitra's relentless passion for innovation and his dedication to pushing the boundaries of technology make him a true pioneer in the field of inventions. His work continues to inspire the next generation of inventors and shape the technological landscape for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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