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For the Inventor, By the Inventor

Amagasaki, Japan

Toshiko Nakagawa

This inventor holds 10 USPTO granted patents and 1 EPO patent. Top assignee: Mec Company Ltd.. Active years: 1996-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toshiko Nakagawa. Retrieved from https://idiyas.com/inventor/toshiko-nakagawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.7

ph-index = 7

Forward Citations = 171(Granted Patents)


Company Filing History:

goldMedal10 out of 61 
 
Mec Company Ltd.
 patents

Years Active: 1996-2007

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10 patents (USPTO):Explore Patents
1. 7156904 - Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby (2007-01-02),
2. 7029761 - Bonding layer for bonding resin on copper surface (2006-04-18),
3. 6733886 - Laminate and method of manufacturing the same (2004-05-11),
4. 6106899 - Method for surface treatment of copper or copper alloys (2000-08-22),
5. 5965036 - Microetching composition for copper or copper alloy (1999-10-12),
6. 5885476 - Composition for microetching copper or copper alloy (1999-03-23),
7. 5807493 - Microetching method for copper or copper alloy (1998-09-15),
8. 5700389 - Etching solution for copper or copper alloy (1997-12-23),
9. 5532094 - Composition for treating copper or copper alloy surfaces (1996-07-02),
10. 5496590 - Composition for treating copper and copper alloy surfaces and method for (1996-03-05),

Title: Innovations by Toshiko Nakagawa

Introduction

Toshiko Nakagawa is a prominent inventor based in Amagasaki, Japan. He has made significant contributions to the field of bonding solutions, particularly in enhancing the adhesion between copper and resin. With a total of 10 patents to his name, Nakagawa's work is recognized for its innovative approaches and practical applications.

Latest Patents

Among his latest patents, Nakagawa has developed a bonding layer forming solution and a method for producing a copper-to-resin bonding layer. This solution includes an aqueous copper-to-resin bonding layer that comprises various components such as acid types, tin salts or oxides, and metals like silver and gold. The method involves forming an alloy layer of tin and selected metals on the copper surface, which enhances the adhesion between copper and resin. His inventions provide effective solutions for creating durable bonding layers that improve the performance of electronic components.

Career Highlights

Toshiko Nakagawa has been instrumental in advancing bonding technologies through his work at Mec Company Ltd. His innovative solutions have not only contributed to the company's success but have also set new standards in the industry. His expertise in material science and engineering has led to breakthroughs that are widely utilized in various applications.

Collaborations

Nakagawa collaborates with talented individuals such as Maki Arimura and Yoshiro Maki. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Toshiko Nakagawa's contributions to the field of bonding solutions exemplify the impact of innovation in enhancing material adhesion. His patents and collaborative efforts continue to shape the future of bonding technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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