The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1999
Filed:
Mar. 04, 1997
Applicant:
Inventors:
Yoong-koo Hong, Amagasaki, JP;
Toshiko Nakagawa, Amagasaki, JP;
Assignee:
MEC Co., Ltd., Amagasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K / ; C09K / ;
U.S. Cl.
CPC ...
252 792 ; 252 794 ;
Abstract
A microetching composition for copper or copper alloys comprising, (a) nitric acid or sulfuric acid, or both, (b) ferric nitrate or ferric sulfate, or both, (c) at least one component selected from a group consisting of unsaturated carboxylic acids, salts of unsaturated carboxylic acid, and anhydrides of unsaturated carboxylic acid, and (d) water. The composition can produce a copper or copper alloy surface exhibiting excellent adhesion to resins such as prepregs and resists and superior solderability. The composition is suitable for the manufacture of printed wiring boards with highly integrated fine line patterns.