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Mec Company Ltd.

USPTO Granted Patents = 61

% Expired Patents = 6.6

EPO Patents = 15

Trademarks = 7

Forward Citations = 391

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95 inventors (with patents filed for the assignee):

Toshiko Nakagawa (10 out of 10 patents)

Takaichi Shimbo (8 out of 8 patents)

Daisaku Akiyama (7 out of 7 patents)

4. Yoshiro Maki (6 out of 6 patents)

5. Kiyoto Tai (5 out of 5 patents)

6. Mutsuyuki Kawaguchi (5 out of 5 patents)

7. Itsuro Tomatsu (4 out of 4 patents)

8. Maki Arimura (4 out of 4 patents)

9. Takashi Haruta (4 out of 4 patents)

10. Masayuki Goto (3 out of 13 patents)

11. Yuki Ogino (3 out of 3 patents)

12. Yasutaka Amitani (3 out of 3 patents)

13. Keisuke Joko (3 out of 3 patents)

14. Yasushi Yamada (3 out of 7 patents)

15. Masayo Kurii (3 out of 3 patents)

Core Competencies:

Etching Agent

Microetching Solution

Copper Wiring

Surface Treatment

Printed Circuit Board

Metal-Resin Composite

Electroplating

Adhesive Composition

Bonding Layer

Coating Composition

Soldering Flux

Chemical Compound

61 patents: Sort by Forward Citations

1. 12649182 - Copper powder for 3D printing, method for producing copper powder for 3D printing, method for producing 3D printed article, and 3D printed article (2026-06-09),

2. 12460303 - Etching agent and method for producing circuit board (2025-11-04),

3. 12404287 - Chemical compound, surface treating agent, surface treating method, and production method for metal-resin composite (2025-09-02),

4. 12371798 - Regenerating method of removal liquid and regenerated removal liquid preliminary (2025-07-29),

5. 12157837 - Adhesive composition, method for producing surface-treated metal member, and method for producing metal-resin composite body (2024-12-03),

6. 12144122 - Method of manufacturing printed circuit board (2024-11-12),

7. 11937573 - Music providing system for non-human animal (2024-03-26),

8. 11761072 - Mg-comprising hot-dip galvanized steel sheet manufacturing method and manufacturing apparatus (2023-09-19),

9. 11535923 - Method for manufacturing molten galvanized steel sheet (2022-12-27),

10. 11230644 - Coating film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite (2022-01-25),

11. 11208726 - Microetching agent for copper, copper surface roughening method and wiring board production method (2021-12-28),

12. 11053594 - Microetchant for copper and method for producing wiring board (2021-07-06),

13. 10883027 - Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite (2021-01-05),

14. 10801112 - Composition for forming coating, production method for surface-treated metal member, and production method for metal-resin composite (2020-10-13),

15. 10329453 - Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite (2019-06-25),

Company Overview

Mec Company Ltd., based in Hyogo, Japan, specializes in advanced copper surface treatment technologies. The company focuses on developing innovative solutions for etching agents and microetching solutions, which are essential for the production of high-quality printed circuit boards. Their expertise extends to copper wiring, surface treatment processes, and metal-resin composites, as well as electroplating and adhesive compositions. Mec Company Ltd. is dedicated to enhancing manufacturing efficiency and product performance in the electronics industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

61 Patents

#20 in Hyogo

#1,512 in Japan

#11,930 in the World

Mec Company Ltd.

Forward Citations = 391

95 inventors:

Toshiko Nakagawa (10 out of 10 patents)

Takaichi Shimbo (8 out of 8 patents)

Daisaku Akiyama (7 out of 7 patents)

4. Yoshiro Maki (6 out of 6 patents)

5. Kiyoto Tai (5 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Mec Company Ltd.. Retrieved from https://idiyas.com/company/mec-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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