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Mec Company Ltd.

USPTO Granted Patents = 58

EPO Patents = 14

Trademarks = 7

Forward Citations = 389

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85 inventors (with patents filed for the assignee):

Toshiko Nakagawa (10 out of 10 patents)

Takaichi Shimbo (8 out of 8 patents)

Daisaku Akiyama (7 out of 7 patents)

4. Yoshiro Maki (6 out of 6 patents)

5. Kiyoto Tai (5 out of 5 patents)

6. Mutsuyuki Kawaguchi (5 out of 5 patents)

7. Itsuro Tomatsu (4 out of 4 patents)

8. Maki Arimura (4 out of 4 patents)

9. Takashi Haruta (4 out of 4 patents)

10. Masayuki Goto (3 out of 13 patents)

11. Yuki Ogino (3 out of 3 patents)

12. Yasutaka Amitani (3 out of 3 patents)

13. Keisuke Joko (3 out of 3 patents)

14. Yasushi Yamada (3 out of 7 patents)

15. Masayo Kurii (3 out of 3 patents)

Core Competencies:

Etching Agent

Microetching Solution

Copper Surface Treatment

Printed Circuit Board Manufacturing

Metal-Resin Composite

Electroconductive Layer

Surface Roughening Agent

Adhesive Composition

Ultrasonic Leakage Inspection

Hot-Dip Galvanized Steel

Bonding Layer Formation

Music Providing System

58 patents: Sort by Forward Citations

1. 12460303 - Etching agent and method for producing circuit board (2025-11-04),

2. 12404287 - Chemical compound, surface treating agent, surface treating method, and production method for metal-resin composite (2025-09-02),

3. 12371798 - Regenerating method of removal liquid and regenerated removal liquid preliminary (2025-07-29),

4. 12157837 - Adhesive composition, method for producing surface-treated metal member, and method for producing metal-resin composite body (2024-12-03),

5. 12144122 - Method of manufacturing printed circuit board (2024-11-12),

6. 11937573 - Music providing system for non-human animal (2024-03-26),

7. 11761072 - Mg-comprising hot-dip galvanized steel sheet manufacturing method and manufacturing apparatus (2023-09-19),

8. 11535923 - Method for manufacturing molten galvanized steel sheet (2022-12-27),

9. 11230644 - Coating film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite (2022-01-25),

10. 11208726 - Microetching agent for copper, copper surface roughening method and wiring board production method (2021-12-28),

11. 11053594 - Microetchant for copper and method for producing wiring board (2021-07-06),

12. 10883027 - Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite (2021-01-05),

13. 10801112 - Composition for forming coating, production method for surface-treated metal member, and production method for metal-resin composite (2020-10-13),

14. 10329453 - Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite (2019-06-25),

15. 10174428 - Etchant, replenishment solution and method for forming copper wiring (2019-01-08),

MEC COMPANY LTD. is a leading global provider of innovative solutions in the manufacturing industry. With over 30 years of experience, we specialize in the design, production, and distribution of high-quality industrial equipment. Our commitment to excellence and customer satisfaction has made us a trusted partner for clients worldwide. Through cutting-edge technology and a dedicated team of professionals, we deliver reliable and cost-effective solutions that cater to the specific needs of our clients. Visit our website to learn more about our products and services.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

58 Patents

#22 in Hyogo

#1,524 in Japan

#12,003 in the World

Mec Company Ltd.

Forward Citations = 389

85 inventors:

Toshiko Nakagawa (10 out of 10 patents)

Takaichi Shimbo (8 out of 8 patents)

Daisaku Akiyama (7 out of 7 patents)

4. Yoshiro Maki (6 out of 6 patents)

5. Kiyoto Tai (5 out of 5 patents)

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