The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Nov. 29, 2019
Mec Company., Ltd., Amagasaki, JP;
Osaka Research Institute of Industrial Science and Technology, Izumi, JP;
Daisuke Katayama, Hyogo, JP;
Masato Nakazawa, Hyogo, JP;
Kaori Igami, Hyogo, JP;
Takahiro Sugahara, Osaka, JP;
Takayuki Nakamoto, Osaka, JP;
Takao Miki, Osaka, JP;
Sohei Uchida, Osaka, JP;
MEC COMPANY, LTD., Amagasaki, JP;
OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY, Izumi, JP;
Abstract
The present invention relates to a copper powder for additive manufacturing, a method for producing the same, an additive manufactured product, a method for producing the same and the like, and an object of the present invention is to provide a copper powder for additive manufacturing that can sufficiently improve the mechanical strength and electrical conductivity of an additive manufactured product. The means for achieving the above-mentioned object of the present invention is, for example, a copper powder for additive manufacturing having a mean particle size of 1 μm or more and 150 μm or less, containing copper oxide in an amount of 0.10 g/mor more and 7.0 g/mor less per unit surface area and 0.5 mass % or more and 9.4 mass % or less per unit mass.