Hyogo, Japan

Masato Nakazawa

This inventor holds 1 USPTO granted patent. Top assignees: Mec Company Ltd., Osaka Research Institute of Industrial Science and Technology. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masato Nakazawa. Retrieved from https://idiyas.com/inventor/masato-nakazawa-aba0gef2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Masato Nakazawa: Innovator in Copper Powder for 3D Printing

Introduction

Masato Nakazawa is a notable inventor based in Hyogo, Japan. He has made significant contributions to the field of additive manufacturing, particularly through his innovative work on copper powder for 3D printing. His inventions aim to enhance the mechanical strength and electrical conductivity of 3D printed products.

Latest Patents

Masato Nakazawa holds a patent related to a copper powder for 3D printing, which includes a method for producing the copper powder and a method for creating 3D printed articles. The patent focuses on providing a copper powder that has a mean particle size ranging from 1 μm to 150 μm. It also specifies the inclusion of copper oxide in precise amounts to improve the properties of the additive manufactured products.

Career Highlights

Throughout his career, Nakazawa has worked with various organizations, including Mec Company Ltd. and the Osaka Research Institute of Industrial Science and Technology. His experience in these institutions has contributed to his expertise in the field of materials science and additive manufacturing.

Collaborations

Masato Nakazawa has collaborated with notable colleagues such as Daisuke Katayama and Kaori Igami. Their joint efforts have likely played a role in advancing research and development in the area of 3D printing technologies.

Conclusion

Masato Nakazawa's innovative work in developing copper powder for 3D printing represents a significant advancement in additive manufacturing. His contributions are poised to impact the industry positively, enhancing the performance of 3D printed products.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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