The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Aug. 20, 2018
Applicant:

Mec Company Ltd., Hyogo, JP;

Inventors:

Yuki Ogino, Hyogo, JP;

Takahiro Sakamoto, Hyogo, JP;

Kaoru Urushibata, Hyogo, JP;

Assignee:

MEC COMPANY LTD., Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/18 (2006.01); C23C 22/52 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
C23F 1/18 (2013.01); C23C 22/52 (2013.01); H05K 3/383 (2013.01); H05K 2203/0789 (2013.01);
Abstract

A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 μm or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.


Find Patent Forward Citations

Loading…