This inventor holds 4 USPTO granted patents. Top assignee: Mec Company Ltd.. Active years: 1991-1999.
Company Filing History:
Years Active: 1991-1999
Title: The Innovations of Takashi Haruta
Introduction
Takashi Haruta is a notable inventor based in Amagasaki, Japan. He has made significant contributions to the field of microetching compositions for copper and copper alloys. With a total of four patents to his name, Haruta's work has had a considerable impact on the manufacturing of printed wiring boards.
Latest Patents
Haruta's latest patents include a microetching composition for copper or copper alloys. This composition comprises an oxidizing agent that can oxidize the copper or copper alloy, a polymer compound containing polyamine chains or a cationic group, and water. The resulting composition produces surfaces of copper or copper alloy that exhibit excellent adhesion to resins such as prepregs and resists, along with superior solderability. This innovation is particularly adaptable for the manufacture of printed wiring boards with highly integrated fine line patterns. Another of his patents details a microetching method for copper or copper alloys, which includes a cupric ion source, an organic acid with an acid dissociation constant (pKa) of 5 or less, a halide ion source, and water. This method also results in surfaces that demonstrate excellent adhesion and solderability, further enhancing the manufacturing process for printed wiring boards.
Career Highlights
Haruta is currently employed at Mec Company Ltd., where he continues to develop innovative solutions in his field. His expertise in microetching has positioned him as a key player in the industry, contributing to advancements in technology and manufacturing processes.
Collaborations
Throughout his career, Haruta has collaborated with talented individuals such as Yoshiro Maki and Toshiko Nakagawa. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Takashi Haruta's contributions to the field of microetching compositions have significantly advanced the manufacturing of printed wiring boards. His innovative patents and collaborations highlight his dedication to improving technology in this area.