The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 1998
Filed:
Jul. 24, 1996
Applicant:
Inventors:
Yoshiro Maki, Amagasaki, JP;
Toshiko Nakagawa, Amagasaki, JP;
Yasushi Yamada, Amagasaki, JP;
Takashi Haruta, Amagasaki, JP;
Maki Arimura, Amagasaki, JP;
Assignee:
MEC Co., Ltd., Amagasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
B44C / ; C23F / ;
U.S. Cl.
CPC ...
216106 ; 252 791 ; 252 794 ;
Abstract
A microetching composition for copper or copper alloys comprising, (a) a cupric ion source, (b) an organic acid with an acid dissociation constant (pKa) of 5 or less, (c) a halide ion source, and (d) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists and superior solderability. The composition can be very adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.