The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2024

Filed:

Jan. 09, 2020
Applicant:

Mec Company Ltd., Amagasaki, JP;

Inventors:

Tomoki Hayashi, Amagasaki, JP;

Itsuro Tomatsu, Amagasaki, JP;

Daisaku Akiyama, Amagasaki, JP;

Assignee:

MEC Company Ltd., Amagasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 11/06 (2006.01); C09J 11/04 (2006.01); C08K 3/16 (2006.01); C08K 3/30 (2006.01); C08K 5/3492 (2006.01);
U.S. Cl.
CPC ...
C09J 11/06 (2013.01); C09J 11/04 (2013.01); C08K 3/16 (2013.01); C08K 3/30 (2013.01); C08K 2003/3081 (2013.01); C08K 5/3492 (2013.01); C09J 2203/326 (2013.01); C09J 2400/163 (2013.01); C09J 2463/006 (2013.01);
Abstract

An adhesive composition for forming an adhesive layer to be in contact with a resin on a surface of a metal, including: a low molecular weight organic compound having two or more nitrogen atoms in one molecule; and at least one metal ion selected from the group consisting of a trivalent aluminum ion and a trivalent chromium ion, wherein the resin is a curable resin, and the adhesive composition is an aqueous solution having a pH of 12 or less and has a concentration of the low molecular weight organic compound of 0.01 to 150 g/L and a molar concentration of the at least one metal ion of 0.005 to 100 mmol/L. The adhesive composition can improve adhesion between surfaces of multiple metals and a resin.


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