Company Filing History:
Years Active: 2024
Title: Tomoki Hayashi: Innovator in Adhesive Technology
Introduction
Tomoki Hayashi is a notable inventor based in Amagasaki, Japan. He has made significant contributions to the field of adhesive technology, particularly through his innovative patent that enhances the adhesion between metals and resins. His work is essential for various applications in manufacturing and materials science.
Latest Patents
Tomoki Hayashi holds a patent for an "Adhesive composition, method for producing surface-treated metal member, and method for producing metal-resin composite body." This adhesive composition is designed to form a strong adhesive layer that contacts a resin on a metal surface. It includes a low molecular weight organic compound with two or more nitrogen atoms and at least one metal ion, specifically a trivalent aluminum ion or a trivalent chromium ion. The composition is an aqueous solution with a pH of 12 or less, featuring a concentration of the organic compound ranging from 0.01 to 150 g/L and a molar concentration of the metal ion from 0.005 to 100 mmol/L. This innovative adhesive improves adhesion between multiple metal surfaces and resin, making it a valuable advancement in the field.
Career Highlights
Tomoki Hayashi is associated with Mec Company Ltd., where he applies his expertise in adhesive technology. His work at the company has been instrumental in developing new materials and improving existing adhesive solutions. His dedication to innovation has positioned him as a key figure in his field.
Collaborations
Tomoki collaborates with talented coworkers, including Itsuro Tomatsu and Daisaku Akiyama. Their combined efforts contribute to the advancement of adhesive technologies and the development of new products.
Conclusion
Tomoki Hayashi is a prominent inventor whose work in adhesive technology has led to significant advancements in the industry. His innovative patent demonstrates his commitment to improving adhesion between metals and resins, showcasing his valuable contributions to materials science.