The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2007
Filed:
Apr. 16, 2004
Mutsuyuki Kawaguchi, Amagasaki, JP;
Satoshi Saito, Amagasaki, JP;
Jun Hisada, Amagasaki, JP;
Naomi Kanda, Amagasaki, JP;
Toshiko Nakagawa, Amagasaki, JP;
Mutsuyuki Kawaguchi, Amagasaki, JP;
Satoshi Saito, Amagasaki, JP;
Jun Hisada, Amagasaki, JP;
Naomi Kanda, Amagasaki, JP;
Toshiko Nakagawa, Amagasaki, JP;
Mec Company Ltd., Hyogo, JP;
Abstract
An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum; (d) a reaction accelerator; and (e) a diffusive retaining solvent, so that an alloy layer of tin and the at least one type of metal selected in (c) is formed on the surface of the copper. Subsequently, a portion of the alloy layer is removed, so that a bonding layer containing an alloy of diffused copper, tin, and the at least one type of metal selected in (c) is formed on a surface of copper which enhances the adhesion between copper and resin. The present invention provides the solution, a method of producing the bonding layer, and a product obtained thereby.