Jun Hisada

Title: Jun Hisada: Innovator in Bonding Layer Technology

Introduction

Jun Hisada is a notable inventor based in Amagasaki, Japan. He has made significant contributions to the field of bonding layer technology, particularly in enhancing the adhesion between copper and resin. His innovative solutions have led to the development of several patents that address critical challenges in this area.

Latest Patents

Jun Hisada holds 3 patents, with his latest inventions focusing on bonding layer solutions. One of his notable patents is a bonding layer forming solution that includes an aqueous copper-to-resin bonding layer solution. This solution comprises various components, including at least one acid type, tin salt or tin oxide, and a selection of metals such as silver, zinc, and aluminum. The method he developed allows for the production of a bonding layer that enhances adhesion between copper and resin, which is crucial for various applications.

Career Highlights

Hisada is currently associated with Mec Company Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the field of bonding layers, making significant strides in improving the quality and effectiveness of these materials.

Collaborations

Throughout his career, Jun Hisada has collaborated with talented individuals, including Mutsuyuki Kawaguchi and Toshiko Nakagawa. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Jun Hisada's contributions to bonding layer technology exemplify the impact of innovative thinking in the field of materials science. His patents and ongoing work continue to influence the industry, paving the way for future advancements.