The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
Apr. 16, 2004
Mutsuyuki Kawaguchi, Amagasaki, JP;
Satoshi Saito, Amagasaki, JP;
Jun Hisada, Amagasaki, JP;
Toshiko Nakagawa, Amagasaki, JP;
Mutsuyuki Kawaguchi, Amagasaki, JP;
Satoshi Saito, Amagasaki, JP;
Jun Hisada, Amagasaki, JP;
Toshiko Nakagawa, Amagasaki, JP;
MEC Company Ltd., Amagasaki, JP;
Abstract
A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum. The copper is contained in an amount of 1 to 50 atom %, the tin is contained in an amount of 20 to 98 atom %, and the third metal is contained in an amount of 1 to 50 atom %. The bonding layer has a thickness of not less than 0.001 μm and not more than 1 μm. Thus, adhesion between copper and resin can be enhanced.