Naomi Kanda

Title: Naomi Kanda - Innovator in Bonding Layer Technology

Introduction

Naomi Kanda is a prominent inventor based in Amagasaki, Japan. She has made significant contributions to the field of bonding layer technology, particularly in the development of solutions that enhance the adhesion between copper and resin. Her innovative work has led to the creation of a patented solution that addresses critical challenges in material bonding.

Latest Patents

Naomi Kanda holds a patent for a bonding layer forming solution, which includes a method of producing a copper-to-resin bonding layer using the solution. The patent describes an aqueous copper-to-resin bonding layer solution that comprises several components, including at least one acid type, tin salt or tin oxide, and a selection of metals such as silver, zinc, and gold. This invention provides a method for creating a bonding layer that significantly improves adhesion between copper and resin, resulting in enhanced performance in various applications.

Career Highlights

Kanda's career is marked by her dedication to innovation and research in material science. She has successfully developed a unique bonding layer solution that has practical applications in industries requiring strong adhesion properties. Her work has not only advanced the field but has also positioned her as a key figure in the development of new bonding technologies.

Collaborations

Naomi Kanda has collaborated with notable colleagues, including Mutsuyuki Kawaguchi and Satoshi Saito. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and expertise, further enhancing the quality and impact of her work.

Conclusion

Naomi Kanda's contributions to bonding layer technology exemplify her innovative spirit and commitment to advancing material science. Her patented solution represents a significant advancement in the field, showcasing her ability to address complex challenges in adhesion.