Mec Company Ltd.

Toshiko Nakagawa

Yoshiro Maki

Mutsuyuki Kawaguchi

Maki Arimura

Takashi Haruta

Jun Hisada

Yasushi Yamada

Satoshi Saito

Daisaku Akiyama

Ryo Ogushi

Sachiko Nakamura

Yoshiaki Furukawa

Maki Yamanami

Minoru Outani

Naomi Kanda

Yoong-koo Hong

An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum; (d) a reaction accelerator; and (e) a diffusive retaining solvent, so that an alloy layer of tin and the at least one type of metal selected in (c) is formed on the surface of the copper. Subsequently, a portion of the alloy layer is removed, so that a bonding layer containing an alloy of diffused copper, tin, and the at least one type of metal selected in (c) is formed on a surface of copper which enhances the adhesion between copper and resin. The present invention provides the solution, a method of producing the bonding layer, and a product obtained thereby.

Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby

A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum. The copper is contained in an amount of 1 to 50 atom %, the tin is contained in an amount of 20 to 98 atom %, and the third metal is contained in an amount of 1 to 50 atom %. The bonding layer has a thickness of not less than 0.001 &#x3bc;m and not more than 1 &#x3bc;m. Thus, adhesion between copper and resin can be enhanced.

Bonding layer for bonding resin on copper surface

A laminate is made by adhering at least one metal layer selected from the group consisting of copper and a copper alloy to a resin layer. A coating film of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in an range from 0.1 mass % to 15 mass % and an organic acid in a range from 1 mass % to 80 mass % is formed on the metal layer surface, and the metal layer adheres to the resin layer via the coating film of the azole-copper complex compound. Thereby, the present invention provides a laminate with improved adhesion between a surface of copper or a copper alloy and resin in a multilayered printed circuit board, and also a method of manufacturing the laminate.

Laminate and method of manufacturing the same

A method for bonding a resin which has a high glass transition temperature but low affinity to copper surfaces with a copper surface with sufficient adhesive strength. The method comprises coating the copper surfaces with an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative, or an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative and at least 0.1% of aminotriazole or an aminotriazole derivative.

Method for surface treatment of copper or copper alloys

A microetching composition for copper or copper alloys comprising, (a) an oxidizing agent which can oxidize the copper or copper alloy, (b) a polymer compound which contains polyamine chains or a cationic group or both in the amount of 0.000001 to 1.0% by weight, and (c) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists, and superior solderability. The composition can be adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.

Microetching composition for copper or copper alloy

A microetching composition for copper or copper alloys comprising, (a) nitric acid or sulfuric acid, or both, (b) ferric nitrate or ferric sulfate, or both, (c) at least one component selected from a group consisting of unsaturated carboxylic acids, salts of unsaturated carboxylic acid, and anhydrides of unsaturated carboxylic acid, and (d) water. The composition can produce a copper or copper alloy surface exhibiting excellent adhesion to resins such as prepregs and resists and superior solderability. The composition is suitable for the manufacture of printed wiring boards with highly integrated fine line patterns.

Composition for microetching copper or copper alloy

A microetching composition for copper or copper alloys comprising, (a) a cupric ion source, (b) an organic acid with an acid dissociation constant (pKa) of 5 or less, (c) a halide ion source, and (d) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists and superior solderability. The composition can be very adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.

Microetching method for copper or copper alloy

An etching solution for copper or copper alloys comprising, (a) sulfuric acid, (b) a persulfate, (c) at least one compound selected from imidazole, imidazole derivatives, pyridine derivatives, triazine, and triazine derivatives, and (d) water. The etching solution exhibits a high etching speed and does not oxidize the copper surfaces after etching.

Etching solution for copper or copper alloy

A method for roughening surfaces of copper or copper alloy to provide an excellent adhesion of a coated or laminated layer thereon, comprising treating said surfaces with an amount and for a time effective to roughen them with an aqueous solution comprising an azole compound, a copper compound dissolvable in the solution, an organic or inorganic acid and a halogen ion.

Composition for treating copper or copper alloy surfaces

A composition for treating surfaces of copper and copper alloys comprising a specific imidazole derivative and water, and an acid or a water-soluble solvent. The composition can produce a heat resistant organic film with superior solderability when applied to surfaces of copper or copper alloys. It is particularly useful as a rust preventing agent for printed-wiring boards.

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Amagasaki, Japan

Toshiko Nakagawa