The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2000

Filed:

Jul. 16, 1998
Applicant:
Inventors:

Toshiko Nakagawa, Amagasaki, JP;

Ryo Ogushi, Amagasaki, JP;

Assignee:

MEC Company Limited, Amagasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427327 ; 427409 ; 427410 ;
Abstract

A method for bonding a resin which has a high glass transition temperature but low affinity to copper surfaces with a copper surface with sufficient adhesive strength. The method comprises coating the copper surfaces with an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative, or an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative and at least 0.1% of aminotriazole or an aminotriazole derivative.


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