The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 1996

Filed:

Feb. 27, 1995
Applicant:
Inventors:

Maki Arimura, Amagasaki, JP;

Daisaku Akiyama, Amagasaki, JP;

Toshiko Nakagawa, Amagasaki, JP;

Assignee:

MEC Co., Ltd., Amagasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K / ;
U.S. Cl.
CPC ...
252 791 ; 252 794 ; 134-3 ; 134 41 ; 1566251 ; 1566341 ; 1566541 ; 1566551 ; 1566561 ;
Abstract

A method for roughening surfaces of copper or copper alloy to provide an excellent adhesion of a coated or laminated layer thereon, comprising treating said surfaces with an amount and for a time effective to roughen them with an aqueous solution comprising an azole compound, a copper compound dissolvable in the solution, an organic or inorganic acid and a halogen ion.


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