Tong Liu

Title: Innovations and Contributions of Tong Liu in Plasma Etching Technologies

Introduction: Tong Liu, an accomplished inventor based in San Jose, California, has made significant strides in the field of substrate processing systems, particularly within inductively coupled plasma (ICP) technology. With a remarkable portfolio of 21 patents, his innovations focus on improving efficiencies and achieving higher conductance in plasma systems, which are essential in various manufacturing processes.

Latest Patents: Among Tong Liu's most recent patents are two groundbreaking technologies in substrate processing. The first patent addresses "Increased deposition efficiency and higher chamber conductance with source power increase in an inductively coupled plasma (ICP) chamber." This invention relates to methods in an etching/deposition process, utilizing a plasma source power of 4,500 Watts or greater to achieve optimal results in protective layer deposition and etching processes.

The second patent, "Laser scribing and plasma etch for high die break strength and clean sidewall," describes a hybrid approach for substrate dicing. This method combines an initial laser scribe with subsequent plasma etching to enhance die singulation, providing clean edges and improved structural integrity. The innovation employs a multi-plasma etching approach, ensuring the die sidewalls are free from roughness and residues.

Career Highlights: Throughout his career, Tong Liu has worked with notable companies such as Actel Corporation and Applied Materials, where he has honed his expertise in plasma etching processes. His experience in these esteemed organizations has allowed him to develop cutting-edge technologies that enhance manufacturing efficiencies.

Collaborations: In addition to his impressive career, Tong Liu has collaborated with talented peers such as Sheng Feng and Jung-Cheun Lien. These partnerships have contributed to the advancement of technologies in substrate processing and have further solidified Liu’s standing in the field of innovation.

Conclusion: Tong Liu's contributions to plasma etching technologies exemplify the vital role of innovative thinking in advancing manufacturing processes. With his 21 patents and continuous involvement in leading companies, Liu is a key figure driving forward the capabilities of substrate processing systems. His work not only enhances production efficiencies but also paves the way for future innovations in the industry.