Essex Junction, VT, United States of America

Timothy Charles Krywanczyk

This inventor holds 35 USPTO granted patents, primarily in Semiconductor Fabrication. Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 1998-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Timothy Charles Krywanczyk. Retrieved from https://idiyas.com/inventor/timothy-charles-krywanczyk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 35

% Patents Active = 45.7

Average Co-Inventor Count = 3.9

ph-index = 6

Forward Citations = 149(Granted Patents)

Location History:

Essex Jct., VT (US) (2006)
Essex Junction, VT (US) (1998 - 2019)

Company Filing History:

34 out of 166,325

International Business Machines Corporation

Years Active: 1998-2019

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Areas of Expertise:

Wafer Thinning

UV Adhesive Removal

Corrosion Prevention

Chemical Mechanical Polishing

Silicon Chicklet

Dicing Operations

Patterned Wafers

Thermally Conductive Films

Image Sensor Protection

Recycling Monitor Wafers

Edge Chipping

Photoresist Application

35 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10192748 - Controlling of etch depth in deep via etching processes and resultant structures (2019-01-29),

2. 8806740 - Silicon chicklet pedestal (2014-08-19),

3. 8595919 - Silicon chicklet pedestal (2013-12-03),

4. 8163602 - Ultraviolet energy curable tape and method of making a semiconductor chip using the tape (2012-04-24),

5. 8034718 - Method to recover patterned semiconductor wafers for rework (2011-10-11),

6. 7987591 - Method of forming silicon chicklet pedestal (2011-08-02),

7. 7932614 - Method of thinning a semiconductor substrate (2011-04-26),

8. 7902682 - Ultraviolet energy curable tape and method of making a semiconductor chip using the tape (2011-03-08),

9. 7867876 - Method of thinning a semiconductor substrate (2011-01-11),

10. 7855130 - Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operations (2010-12-21),

11. 7844099 - Inspection method for protecting image sensor devices with front surface protection (2010-11-30),

12. 7771560 - Methods to prevent ECC (edge chipping and cracking) damage during die picking process (2010-08-10),

13. 7732303 - Method for recycling of ion implantation monitor wafers (2010-06-08),

14. 7722446 - System and device for thinning wafers that have contact bumps (2010-05-25),

15. 7700488 - Recycling of ion implantation monitor wafers (2010-04-20),

Title: Innovator Spotlight: Timothy Charles Krywanczyk

Introduction:

Timothy Charles Krywanczyk, a prolific inventor hailing from Essex Junction, VT (US), is renowned for his groundbreaking work in the semiconductor industry. With an impressive portfolio of 35 patents, Krywanczyk continues to push the boundaries of technology with his innovative solutions.

Latest Patents:

Among his latest patents is the "Controlling of etch depth in deep via etching processes and resultant structures." This patent focuses on a method to control the depth of etch in deep via etching processes, enhancing semiconductor structures' precision and performance. Additionally, the "Silicon chicklet pedestal" patent introduces a novel design for wafer-level test probes, showcasing Krywanczyk's versatility in semiconductor engineering.

Career Highlights:

Having worked at esteemed companies such as IBM and Globalfoundries Inc., Krywanczyk has honed his skills and expertise in the semiconductor industry. His contributions have significantly impacted the development of cutting-edge technologies, solidifying his reputation as a visionary innovator.

Collaborations:

Throughout his career, Krywanczyk has collaborated with industry stalwarts like Steven Ross Codding and Donald W Brouillette. These partnerships have led to the creation of groundbreaking solutions and fostered a culture of innovation within the semiconductor sector.

Conclusion:

In conclusion, Timothy Charles Krywanczyk's remarkable journey as an inventor underscores his unwavering commitment to advancing technology and driving innovation forward. His impressive patent portfolio and collaborative efforts exemplify his dedication to shaping the future of the semiconductor industry.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]