The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
Dec. 23, 2008
Steven R. Codding, Underfill Center, VT (US);
Timothy C. Krywanczyk, Essex Junction, VT (US);
Timothy E. Neary, Essex Junction, VT (US);
Edmund J. Sprogis, Underhill, VT (US);
Steven R. Codding, Underfill Center, VT (US);
Timothy C. Krywanczyk, Essex Junction, VT (US);
Timothy E. Neary, Essex Junction, VT (US);
Edmund J. Sprogis, Underhill, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A C4 grind tape and a laser-ablative adhesive layer are formed on a front side of a semiconductor substrate. A carrier substrate is thereafter attached to the laser-ablative adhesive layer. The back side of the semiconductor substrate is thinned by polishing or grinding, during which the carrier substrate provides mechanical support to enable thinning of the semiconductor substrate to a thickness of about 25 μm. A film frame tape is attached to the back side of the thinned semiconductor substrate and the laser-ablative adhesive layer is ablated by laser, thereby dissociating the carrier substrate from the back side of the C4 grind tape. The assembly of the film frame tape, the thinned semiconductor substrate, and the C4 grind tape is diced. The C4 grind tape is irradiated by ultraviolet light to become less adhesive, and is subsequently removed.