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For the Inventor, By the Inventor

Underhill Center, VT, United States of America

Steven Ross Codding

USPTO Granted Patents = 11

Average Co-Inventor Count = 4.0

ph-index = 4

Forward Citations = 31(Granted Patents)


Location History:

  • Underhill, VT (US) (2009)
  • Underhill Center, VT (US) (2006 - 2011)
  • Underfill Center, VT (US) (2011)

Company Filing History:

goldMedal11 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 2006-2011

where 'Filed Patents' based on already Granted Patents

11 patents (USPTO):
1. 8034718 - Method to recover patterned semiconductor wafers for rework (2011-10-11),
2. 7932614 - Method of thinning a semiconductor substrate (2011-04-26),
3. 7867876 - Method of thinning a semiconductor substrate (2011-01-11),
4. 7732303 - Method for recycling of ion implantation monitor wafers (2010-06-08),
5. 7700488 - Recycling of ion implantation monitor wafers (2010-04-20),
6. 7666689 - Method to remove circuit patterns from a wafer (2010-02-23),
7. 7572739 - Tape removal in semiconductor structure fabrication (2009-08-11),
8. 7498236 - Silicon wafer thinning end point method (2009-03-03),
9. 7387911 - Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking (2008-06-17),
10. 7348216 - Rework process for removing residual UV adhesive from C4 wafer surfaces (2008-03-25),
11. 7025891 - Method of polishing C4 molybdenum masks to remove molybdenum peaks (2006-04-11),

Title: The Innovations of Steven Ross Codding

Introduction

Steven Ross Codding is a notable inventor based in Underhill Center, Vermont. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work focuses on methods that enhance the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

Codding's latest patents include a method to recover patterned semiconductor wafers for rework. This innovative method involves blasting the surface of a semiconductor wafer with particles to remove substantially all patterned circuit structures. Following this, grinding, polishing, and cleaning processes are employed to eliminate any remaining circuit structures and achieve a desired smoothness across the wafer's surface. Another significant patent is a method of thinning a semiconductor substrate. This process utilizes a C4 grind tape and a laser-ablative adhesive layer, allowing for precise thinning of the substrate while maintaining mechanical support.

Career Highlights

Codding is currently employed at International Business Machines Corporation (IBM), where he continues to develop cutting-edge technologies in the semiconductor industry. His expertise and innovative approaches have positioned him as a key player in his field.

Collaborations

Throughout his career, Codding has collaborated with talented individuals such as Timothy Charles Krywanczyk and Edmund Juris Sprogis. These collaborations have further enriched his work and contributed to the advancement of semiconductor technologies.

Conclusion

Steven Ross Codding's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His innovative methods continue to shape the future of the industry.

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