The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2006
Filed:
Aug. 29, 2003
Steven R. Codding, Underhill Center, VT (US);
Timothy C. Krywanczyk, Essex Junction, VT (US);
Joseph D. Danaher, Hinesburg, VT (US);
John C. Malinowski, Jericho, VT (US);
James R. Palmer, Hinesburg, VT (US);
Melvin T. Kelly, Starksboro, VT (US);
Caitlin W. Weinstein, Cambridge, MA (US);
Wolfgang Sauter, Richmond, MA (US);
Steven R. Codding, Underhill Center, VT (US);
Timothy C. Krywanczyk, Essex Junction, VT (US);
Joseph D. Danaher, Hinesburg, VT (US);
John C. Malinowski, Jericho, VT (US);
James R. Palmer, Hinesburg, VT (US);
Melvin T. Kelly, Starksboro, VT (US);
Caitlin W. Weinstein, Cambridge, MA (US);
Wolfgang Sauter, Richmond, MA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of treating a molybdenum (moly) mask used in a C4 process to pattern C4 contacts. The moly mask has a wafer side which contacts a wafer during the C4 process and has a rough surface that includes spikes/projections of moly. The moly mask also has a non wafer side and a plurality of holes extending through the mask to pattern C4 contacts in the C4 process. An adhesive layer, such as an adhesive tape, is applied to the non wafer side of the moly mask, to enable a polishing tool to pull a vacuum on the non wafer side of the moly mask in spite of the presence of the holes to secure the moly mask during a subsequent polishing step. The tape also functions as a cushion so that defects on the non wafer side of the moly mask do not replicate through the moly mask to the polished wafer side of the moly mask. The wafer side of the moly mask is then subjected to mechanical or chemical/mechanical polishing to substantially remove the spikes of moly without significantly altering the dimensions of the moly mask or the holes.