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John Chester Malinowski

USPTO Granted Patents = 15 (Patent Applications = 1)

Average Co-Inventor Count = 4.3

ph-index = 7

Forward Citations = 172(Granted Patents)

Location History:

Wappingers Falls, NY (US) (1993)
Jericho, VT (US) (2001 - 2016)

Company Filing History:

13 out of 164,197

International Business Machines Corporation

Years Active: 1993-2016

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15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9287345 - Semiconductor structure with thin film resistor and terminal bond pad (2016-03-15),

2. 9230921 - Self-healing crack stop structure (2016-01-05),

3. 8729664 - Discontinuous guard ring (2014-05-20),

4. 8565510 - Methods for reading a feature pattern from a packaged die (2013-10-22),

5. 8563336 - Method for forming thin film resistor and terminal bond pad simultaneously (2013-10-22),

6. 8299609 - Product chips and die with a feature pattern that contains information relating to the product chip (2012-10-30),

7. 8187897 - Fabricating product chips and die with a feature pattern that contains information relating to the product chip (2012-05-29),

8. 7067914 - Dual chip stack method for electro-static discharge protection of integrated circuits (2006-06-27),

9. 7053460 - Multi-level RF passive device (2006-05-30),

10. 7025891 - Method of polishing C4 molybdenum masks to remove molybdenum peaks (2006-04-11),

11. 6656815 - Process for implanting a deep subcollector with self-aligned photo registration marks (2003-12-02),

12. 6656375 - Selective nitride: oxide anisotropic etch process (2003-12-02),

13. 6413868 - Modular high frequency integrated circuit structure (2002-07-02),

14. 6259148 - Modular high frequency integrated circuit structure (2001-07-10),

15. 5204280 - Process for fabricating multiple pillars inside a dram trench for (1993-04-20),

Title: Celebrating the Innovations of John Chester Malinowski

Introduction: John Chester Malinowski is a notable inventor based in Jericho, Vermont, known for his remarkable contributions to the field of semiconductor technology. With a commendable portfolio of 15 patents, Malinowski has played a vital role in advancing innovations that enhance the performance and reliability of integrated circuits.

Latest Patents: Among his latest inventions, Malinowski has developed a "Semiconductor structure with thin film resistor and terminal bond pad." This innovative method allows for the simultaneous formation of a terminal bond pad on a terminal wire and a thin film resistor on two other wires, streamlining the manufacturing process. Another significant patent is the "Self-healing crack stop structure," which includes methods of manufacture for a structure designed to prevent the propagation of cracks in integrated circuit chips. This crack stop comprises self-healing material that seals cracks as they form, thus ensuring greater durability of the technological components.

Career Highlights: Throughout his impressive career, John Chester Malinowski has been affiliated with prestigious companies like IBM and Globalfoundries Inc. His experience at these leading firms has allowed him to refine his skills and contribute to groundbreaking technologies in the semiconductor industry.

Collaborations: Malinowski has collaborated with other talented professionals, including John Maxwell Cohn and Mark J. Flemming. These partnerships have fostered an environment of innovation, leading to the creation of significant advancements in the field.

Conclusion: John Chester Malinowski's work exemplifies the spirit of innovation and dedication prominent in the field of semiconductor engineering. His contributions not only advance technology but also inspire future generations of inventors to continue pushing the boundaries of what is possible.

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