The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2012
Filed:
Aug. 19, 2008
John M. Cohn, Richmond, VT (US);
Mark J. Flemming, Essex Junction, VT (US);
John C. Malinowski, Jericho, VT (US);
Karl V. Swanke, Essex Junction, VT (US);
John M. Cohn, Richmond, VT (US);
Mark J. Flemming, Essex Junction, VT (US);
John C. Malinowski, Jericho, VT (US);
Karl V. Swanke, Essex Junction, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Product chips and die, methods for fabricating product chips, and methods for tracking the identity of die after singulation from a wafer. The product chips and die include a pattern of features formed in a metallization level of a back-end-of-line (BEOL) wiring structure. The features in the pattern contain information relating to the die, such as a unique identifier that includes a wafer identification for a wafer used to fabricate the die and a product chip location for the die on the wafer. The features may be imaged with the assistance of a beam of electromagnetic radiation that penetrates into a packaged die and is altered by the presence of the features in a way that promotes imaging.