The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2016
Filed:
Aug. 29, 2013
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Fen Chen, Williston, VT (US);
Jeffrey P. Gambino, Westford, VT (US);
Zhong-Xiang He, Essex Junction, VT (US);
Tom C. Lee, Essex Junction, VT (US);
John C. Malinowski, Jericho, VT (US);
Anthony K. Stamper, Williston, VT (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01C 7/00 (2006.01); H01C 17/075 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 28/20 (2013.01); H01C 7/006 (2013.01); H01C 17/075 (2013.01); H01L 21/7685 (2013.01); H01L 23/5228 (2013.01); H01L 23/53295 (2013.01); H01L 24/11 (2013.01); H01L 28/24 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02313 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05546 (2013.01); H01L 2224/13099 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01016 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/04953 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19043 (2013.01);
Abstract
Disclosed are methods for forming a thin film resistor and terminal bond pad simultaneously. A method includes simultaneously forming a terminal bond pad on a terminal wire and a thin film resistor on two other wires.