The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2008
Filed:
Nov. 16, 2004
David M Audette, Colchester, VT (US);
Steven R. Codding, Underhill Center, VT (US);
Timothy C. Krywanczyk, Essex Junction, VT (US);
Brian J. Thibault, Hinesburg, VT (US);
Matthew R. Whalen, Chelsea, VT (US);
David M Audette, Colchester, VT (US);
Steven R. Codding, Underhill Center, VT (US);
Timothy C. Krywanczyk, Essex Junction, VT (US);
Brian J. Thibault, Hinesburg, VT (US);
Matthew R. Whalen, Chelsea, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A thermally conductive protective film or layer is applied to the backside surface of a semiconductor wafer prior to a subsequent dicing operation performed on the wafer to singulate the wafer into diced semiconductor chips, during which the thin thermally conductive film minimizes and prevents chipping and cracking damage to the wafer and diced chips. During subsequent electrical operation of a diced chip, the thin thermally conductive film functions as a thermal conductor to dissipate and conduct away to a heat sink any heat generated during operation of the chip.