The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2010
Filed:
Apr. 21, 2003
Robert R Cadieux, St. Albans, VT (US);
Scott a Estes, Essex Junction, VT (US);
Timothy C Krywanczyk, Essex Junction, VT (US);
Robert R Cadieux, St. Albans, VT (US);
Scott A Estes, Essex Junction, VT (US);
Timothy C Krywanczyk, Essex Junction, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An improved method of dicing a semiconductor wafer which substantially reduces or eliminates corrosion of copper-containing, aluminum bonding pads. The method involves continuously contacting the bonding pads with deionized water and an effective amount of a copper corrosion inhibiting agent, most preferably benzotriazole. Also disclosed, is an improved apparatus for dicing a wafer, in which a copper corrosion inhibiting agent is included in the cooling system for cooling the dicing blade.