logo

For the Inventor, By the Inventor

Osaka, Japan

Tatsuo Sasaoka

This inventor holds 20 USPTO granted patents and 1 published patent application and 3 EPO patents, primarily in Semiconductor Packaging. Top assignees: Panasonic Intellectual Property Management Co., Ltd., Matsushita Electric Industrial Co., Ltd., Panasonic Corporation. Active years: 2002-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tatsuo Sasaoka. Retrieved from https://idiyas.com/inventor/tatsuo-sasaoka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 

% Patents Active = 35.0

 

Average Co-Inventor Count = 3.0

ph-index = 3

Forward Citations = 39(Granted Patents)


Location History:

  • Osaka-fu, JP (2002)
  • Osaka, JP (2003 - 2021)

Company Filing History:

goldMedal8 out of 13,338 
 
Panasonic Intellectual Property Management Co., Ltd.
 patents
silverMedal7 out of 27,375 
 
Matsushita Electric Industrial Co., Ltd.
 patents
bronzeMedal5 out of 16,454 
 
Panasonic Corporation
 patents

Years Active: 2002-2021

Loading Chart...
Loading Chart...
Areas of Expertise:
Thermoelectric Conversion
Semiconductor Device
Wiring Substrate
Mounting Structure
Encapsulated Device
Passive Component
Bonding Method
Film Substrate Treatment
Low Pressure Plasma
Joining Apparatus
Chip Mounting
Anti-Corrosion Film
20 patents (USPTO):Explore Patents
1. 11056632 - Thermoelectric conversion substrate, thermoelectric conversion module and method for producing thermoelectric conversion substrate (2021-07-06),
2. 11011319 - Electronic component (2021-05-18),
3. 10679920 - Semiconductor device having semiconductor package in a wiring board opening (2020-06-09),
4. 10629792 - Wiring substrate and production method thereof (2020-04-21),
5. 9246073 - Mounting structure, and method of manufacturing mounting structure (2016-01-26),
6. 9240369 - Encapsulated semiconductor device and method for manufacturing the same (2016-01-19),
7. 9030003 - Encapsulated semiconductor device and method for manufacturing the same (2015-05-12),
8. 9013029 - Joined body having an anti-corrosion film formed around a junction portion, and a semiconductor device having the same (2015-04-21),
9. 8686545 - Semiconductor device and method for manufacturing the same (2014-04-01),
10. 8240539 - Joining apparatus with UV cleaning (2012-08-14),
11. 7968800 - Passive component incorporating interposer (2011-06-28),
12. 7907420 - Bare chip mounted structure and mounting method (2011-03-15),
13. 7659148 - Bonding method and apparatus (2010-02-09),
14. 6996889 - Electronic part mounting apparatus and method (2006-02-14),
15. 6949144 - Low pressure plasma processing apparatus and method (2005-09-27),

Title: The Innovative Journey of Tatsuo Sasaoka

Introduction: Tatsuo Sasaoka, a pioneering inventor hailing from Osaka, Japan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Tatsuo Sasaoka holds several patents in the field of robotics and artificial intelligence, with his most recent inventions focusing on advanced human-robot interaction systems.

Career Highlights: Throughout his illustrious career, Sasaoka has worked with leading tech companies in Japan, spearheading research and development projects that have pushed the boundaries of innovation in the robotics industry.

Collaborations: Sasaoka has collaborated with top research institutions and universities worldwide, fostering a culture of knowledge exchange and innovation in the field of robotics.

Conclusion: Tatsuo Sasaoka's relentless pursuit of technological advancement and his passion for innovation continue to inspire the next generation of inventors and engineers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…