The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2010
Filed:
Apr. 06, 2005
Tatsuo Sasaoka, Osaka, JP;
Satoshi Horie, Osaka, JP;
Isamu Aokura, Osaka, JP;
Yoshihiko Yagi, Hyogo, JP;
Kazuki Fukada, Osaka, JP;
Tatsuo Sasaoka, Osaka, JP;
Satoshi Horie, Osaka, JP;
Isamu Aokura, Osaka, JP;
Yoshihiko Yagi, Hyogo, JP;
Kazuki Fukada, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A bonding method and an apparatus that enable metal bonding under the atmospheric pressure and at room temperature, wherein the surfaces of objects () to be bonded together are cleaned in an initial cleaning step (S) to remove bonding inhibitor substances (G) such as oxides and adhered substances; one () of the bonding surfaces is provided with an uneven profile with a predetermined roughness in a surface roughness control step (S); a surface treatment step (S) is performed to remove the substances (F) that have been removed but adhered to the bonding surfaces () again; and the uneven bonding surface () is pressed against the other bonding surface () to bond them together.