Yoshihiko Yagi

This inventor holds 25 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignees: Panasonic Corporation, Matsushita Electric Industrial Co., Ltd., Tec Gihan Co., Ltd.. Active years: 1997-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshihiko Yagi. Retrieved from https://idiyas.com/inventor/yoshihiko-yagi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 (Patent Applications = 1)

% Patents Active = 28.0

Average Co-Inventor Count = 3.2

ph-index = 8

Forward Citations = 235(Granted Patents)

Location History:

Ashiya, JP (1997 - 2009)
Osaka, JP (2011)
Kanagawa, JP (2013)
Hyogo, JP (2010 - 2014)
Kadoma, JP (2019)

Company Filing History:

15 out of 16,454

Panasonic Corporation

patents

10 out of 27,375

Matsushita Electric Industrial Co., Ltd.

where one patent can have more than one assignee

Years Active: 1997-2019

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Areas of Expertise:

Ingot Cutting Apparatus

Three-Dimensional Circuit Board

Conductive Bump

Electronic Component

Relay Substrate

Substrate Joining Member

Interconnect Substrate

Bonding Method

Semiconductor Device

Mounting Structure

Card Type Recording Medium

Stereoscopic Circuit Device

25 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10363685 - Ingot cutting apparatus, and load detecting device used in ingot cutting apparatus (2019-07-30),

2. 8809693 - Three-dimensional circuit board (2014-08-19),

3. 8575751 - Conductive bump, method for producing the same, and electronic component mounted structure (2013-11-05),

4. 8208270 - Substrate joining member and three-dimensional structure using the same (2012-06-26),

5. 8159829 - Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrate (2012-04-17),

6. 8134081 - Three-dimensional circuit board and its manufacturing method (2012-03-13),

7. 8120188 - Electronic component mounting structure and method for manufacturing the same (2012-02-21),

8. 8119449 - Method of manufacturing an electronic part mounting structure (2012-02-21),

9. 8033016 - Method for manufacturing an electrode and electrode component mounted body (2011-10-11),

10. 8018731 - Interconnect substrate and electronic circuit mounted structure (2011-09-13),

11. 7928566 - Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device (2011-04-19),

12. 7845954 - Interconnecting board and three-dimensional wiring structure using it (2010-12-07),

13. 7762819 - Substrate connecting member and connecting structure (2010-07-27),

14. 7659148 - Bonding method and apparatus (2010-02-09),

15. 7613010 - Stereoscopic electronic circuit device, and relay board and relay frame used therein (2009-11-03),

Title: The Innovative Mind of Yoshihiko Yagi

Introduction: Yoshihiko Yagi, a distinguished inventor hailing from Hyogo, Japan, is renowned for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Yoshihiko Yagi's recent patents showcase his continuous dedication to pushing the boundaries of technological advancement, with a focus on improving everyday life through innovative solutions.

Career Highlights: Throughout his illustrious career, Yoshihiko Yagi has demonstrated a remarkable ability to transform ideas into tangible inventions that have had a significant impact on various industries. His keen eye for detail and passion for innovation have led to the creation of numerous groundbreaking technologies.

Collaborations: Yoshihiko Yagi's collaborative spirit has seen him work with some of the brightest minds in the industry, leading to the development of cutting-edge products and solutions that have revolutionized the way we live and work.

Conclusion: Yoshihiko Yagi's relentless pursuit of innovation and his unwavering commitment to excellence make him a true pioneer in the world of technology, inspiring generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: