The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2011

Filed:

Jun. 19, 2007
Applicants:

Daisuke Sakurai, Osaka, JP;

Masato Mori, Osaka, JP;

Yoshihiko Yagi, Hyogo, JP;

Inventors:

Daisuke Sakurai, Osaka, JP;

Masato Mori, Osaka, JP;

Yoshihiko Yagi, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

Interconnect substrate () that connects at least the first circuit board and the second circuit board. Interconnect substrate () includes housing () and connecting terminal electrodes for connecting the top and bottom faces of housing (). Housing () has protrusion () on its outer periphery and opening () in its inner periphery.


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