Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Tec Gihan Co., Ltd.

Yoshihiko Yagi

Daisuke Sakurai

Hiroyuki Otani

Masato Mori

Norihito Tsukahara

Kazushi Higashi

Takahiro Yonezawa

Kenichi Yamamoto

Masahiro Ono

Yoshihiro Tomura

Kunio Hibino

Yoshifumi Kitayama

Kazuhiro Nishikawa

Yasushi Nakagiri

Koichi Nagai

Daido Komyoji

Kazuto Nishida

Akihiro Miyashita

Michiro Yoshino

Masayuki Takahashi

Tatsuo Sasaoka

Kazuki Fukada

Isamu Aokura

Koichi Kumagai

Satoshi Horie

Kazuhiro Uji

Kazumi Koketsu

Yotaro Tsuchiya

Kunio Sakurai

Shigeru Kondo

Koujiro Nakamura

In an ingot cutting apparatus that cuts an ingot using a plurality of stretched wires, load sensors are provided on the new wire side and the old wire side of the ingot, and loads applied to the new wire side and the old wire side of the ingot are measured using the load sensors on the new wire side and the old wire side. When measuring the loads, for example, the center of moment about the X-axis that is the running direction of the wire is calculated. When the deviation from the center of gravity of the ingot is greater than or equal to a reference value, notification for replacement of the wire, control of the conveying speed of the wire, control of the pressing speed of the ingot, and so forth are performed through a control unit.

Ingot cutting apparatus, and load detecting device used in ingot cutting apparatus

A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape.

Three-dimensional circuit board

A conductive bump formed on an electrode surface of an electronic component. This conductive bump is composed of a plurality of photosensitive resin layers having different conductive filler contents. Consequently, this conductive bump is able to realize conflicting functions, namely, improvement in adhesion strength with the electrode and reduction of contact resistance.

Conductive bump, method for producing the same, and electronic component mounted structure

Three-dimensional structure () of the present invention includes first module board (), second module board (), and substrate joining member () that unifies board () and board () into one body, thereby electrically connecting these two elements together. The unification is done by molding the outer wall of housing () of substrate joining member () with resin (). Substrate joining member () used in the three-dimensional structure () includes multiple lead terminals () made of conductive material, and a frame-shaped and insulating housing () to which frame the lead terminals () are fixed vertically in a predetermined array. Housing () includes projections () on at least two outer wall faces of its frame shape.

Substrate joining member and three-dimensional structure using the same

Relay substrate () connecting between at least a first circuit board and a second circuit board, including housing () having recess () provided in the outer circumference and hole () provided in the inner circumference; plural connecting terminal electrodes () connecting between the top and bottom surfaces of housing (); shield electrode () provided in recess (); and ground electrode () provided on a part of the top and bottom surfaces of housing ().

Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrate

Three-dimensional circuit board and its manufacturing method

An electronic component mounting structure includes an electronic component provided with a plurality of electrode terminals, and a mounting substrate provided with connector terminals in positions corresponding to the electrode terminals. An electrode terminal is connected to a connector terminal via a protrusion electrode disposed on the electrode terminal or the connector terminal, and the protrusion electrode includes a conductive filler and a photosensitive resin. The photosensitive resin varies in resin component crosslink density in the height direction of the protrusion electrode.

Electronic component mounting structure and method for manufacturing the same

An electronic part mounting structure includes electronic part having a plurality of electrode terminals, a substrate provided with connection terminals in locations corresponding to these electrode terminals, and protruding electrode for connecting one of electrode terminals and one of connection terminals, where electrode terminal of electronic part and connection terminal of substrate are connected through protruding electrode and protruding electrode is formed of a conductive resin including a photosensitive resin and a conductive filler.

Method of manufacturing an electronic part mounting structure

A protruding electrodes is formed on a lead electrode of an electronic component, and the protruding electrodes comprises a first conductor formed on the lead electrode of the electronic component, and a second conductor overlaid on the first conductor by using a transfer mold having a concavity. By virtue of this structure, protruding electrodes of any configuration can be formed in fine pitches.

Method for manufacturing an electrode and electrode component mounted body

Interconnect substrate () that connects at least the first circuit board and the second circuit board. Interconnect substrate () includes housing () and connecting terminal electrodes for connecting the top and bottom faces of housing (). Housing () has protrusion () on its outer periphery and opening () in its inner periphery.

Interconnect substrate and electronic circuit mounted structure

Conductive bump () formed on a surface of electrode terminal () of an electronic component. Conductive bump () is composed of at least a plurality of cured resin materials having different conductive filler densities. Thus, a short circuit and a connection failure due to crush of conductive bump () at the time of mounting can be prevented.

Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device

A first circuit board () mounted with an electronic component () and a second circuit board () are vertically connected three-dimensionally through an interconnecting board () wherein the terminal portion () of the land electrode () on the interconnecting board () is buried in the termination material () of the interconnecting board (). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

Interconnecting board and three-dimensional wiring structure using it

A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

Substrate connecting member and connecting structure

A bonding method and an apparatus that enable metal bonding under the atmospheric pressure and at room temperature, wherein the surfaces of objects () to be bonded together are cleaned in an initial cleaning step (S) to remove bonding inhibitor substances (G) such as oxides and adhered substances; one () of the bonding surfaces is provided with an uneven profile with a predetermined roughness in a surface roughness control step (S); a surface treatment step (S) is performed to remove the substances (F) that have been removed but adhered to the bonding surfaces () again; and the uneven bonding surface () is pressed against the other bonding surface () to bond them together.

Bonding method and apparatus

A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.

Growing community of inventors

Hyogo, Japan

Yoshihiko Yagi