The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8208270 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 26, 2012

Filed:

Apr. 23, 2007
Applicants:

Masato Mori, Osaka, JP;

Daido Komyoji, Nara, JP;

Koichi Nagai, Kyoto, JP;

Yoshihiko Yagi, Hyogo, JP;

Inventors:

Masato Mori, Osaka, JP;

Daido Komyoji, Nara, JP;

Koichi Nagai, Kyoto, JP;

Yoshihiko Yagi, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

Three-dimensional structure () of the present invention includes first module board (), second module board (), and substrate joining member () that unifies board () and board () into one body, thereby electrically connecting these two elements together. The unification is done by molding the outer wall of housing () of substrate joining member () with resin (). Substrate joining member () used in the three-dimensional structure () includes multiple lead terminals () made of conductive material, and a frame-shaped and insulating housing () to which frame the lead terminals () are fixed vertically in a predetermined array. Housing () includes projections () on at least two outer wall faces of its frame shape.


Find Patent Forward Citations

Mori, Masato. (2012). Substrate joining member and three-dimensional structure using the same (U.S. Patent No. 8208270). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8208270

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