The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2011
Filed:
Nov. 20, 2007
Applicants:
Yoshihiko Yagi, Hyogo, JP;
Daisuke Sakurai, Osaka, JP;
Inventors:
Yoshihiko Yagi, Hyogo, JP;
Daisuke Sakurai, Osaka, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
Conductive bump () formed on a surface of electrode terminal () of an electronic component. Conductive bump () is composed of at least a plurality of cured resin materials having different conductive filler densities. Thus, a short circuit and a connection failure due to crush of conductive bump () at the time of mounting can be prevented.