The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2010
Filed:
Apr. 17, 2006
Yoshihiro Tomura, Osaka, JP;
Yasushi Nakagiri, Kyoto, JP;
Kunio Hibino, Osaka, JP;
Yoshihiko Yagi, Hyogo, JP;
Akihiro Miyashita, Kanagawa, JP;
Masahiro Ono, Osaka, JP;
Masato Mori, Osaka, JP;
Yoshihiro Tomura, Osaka, JP;
Yasushi Nakagiri, Kyoto, JP;
Kunio Hibino, Osaka, JP;
Yoshihiko Yagi, Hyogo, JP;
Akihiro Miyashita, Kanagawa, JP;
Masahiro Ono, Osaka, JP;
Masato Mori, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A first circuit board () mounted with an electronic component () and a second circuit board () are vertically connected three-dimensionally through an interconnecting board () wherein the terminal portion () of the land electrode () on the interconnecting board () is buried in the termination material () of the interconnecting board (). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.