The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Mar. 26, 2012
Masanori Minamio, Osaka, JP;
Tatsuo Sasaoka, Osaka, JP;
Masanori Minamio, Osaka, JP;
Tatsuo Sasaoka, Osaka, JP;
Abstract
An encapsulated semiconductor device includes: a first conduction path formative plate (); a second conduction path formative plate () joined to the first conduction path formative plate; a power element () bonded to the first conduction path formative plate; a heatsink () held by the first conduction path formative plate with an insulation sheet () interposed between the heatsink and the first conduction path formative plate; and an encapsulation resin () configured to encapsulate the first and second conduction path formative plates. A through hole () or a lead gap () is formed in a region of the first conduction path formative plate in contact with the insulation sheet. The insulation sheet is press-fitted into the through hole or the lead gap.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile