The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2020
Filed:
Jun. 08, 2018
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Tatsuo Sasaoka, Osaka, JP;
Abstract
Wiring substrates include: an insulation resin layer; a conductor-wiring layer that is placed on a surface of the insulation resin layer; and a metal substrate that is placed on an opposite surface of the insulation resin layer and that covers an edge of the insulation resin layer. Also, methods for producing a wiring substrate include: (i) forming a recess on a wiring substrate including a conductor-wiring layer, an insulation resin layer, and a metal substrate that are stacked; and (ii) cutting at least a part of the recess of the wiring substrate by using at least one die to form at least one separated piece of the wiring substrate in which a part of an edge of the insulation resin layer is covered by the metal substrate.