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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9246073 B1

PDFFull Text
Date of Patent:
Jan. 26, 2016

Filed:

Jun. 18, 2009

Mounting structure, and method of manufacturing mounting structure

Applicants:

Tatsuo Sasaoka, Osaka, JP;

Kaori Toyoda, Hyogo, JP;

Kentaro Nishiwaki, Osaka, JP;

Hiroki Ikeuchi, Osaka, JP;

Hiroshi Nasu, Osaka, JP;

Inventors:

Tatsuo Sasaoka, Osaka, JP;

Kaori Toyoda, Hyogo, JP;

Kentaro Nishiwaki, Osaka, JP;

Hiroki Ikeuchi, Osaka, JP;

Hiroshi Nasu, Osaka, JP;

Assignee:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Attorney:

RatnerPrestia

Primary Examiner:

Erin Saad

Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01L 33/62 (2010.01); B23K 35/02 (2006.01); B23K 1/00 (2006.01); H01L 23/00 (2006.01); H01L 33/64 (2010.01); H05K 3/32 (2006.01); H01L 21/56 (2006.01); H01L 31/024 (2014.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 33/641 (2013.01); H05K 3/321 (2013.01); H01L 21/563 (2013.01); H01L 31/024 (2013.01); H01L 33/647 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29076 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/838 (2013.01); H01L 2224/8314 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/0106 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/351 (2013.01); H05K 3/4007 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/2036 (2013.01); H05K 2203/1131 (2013.01); H05K 2203/1178 (2013.01);
Abstract

A mounting structure is provided that can allow gaseous matter generated when performing a heat treatment to escape to outside efficiently. A mounting structureincludes a substratehaving electrodesand, an electronic componenthaving electrodesand, jointsandthat electrically connect the electrodesandof the substrateand the electrodesandof the electronic componentand also fix the electronic componentto the surface of the substrate, and a convex portionthat abuts against the electrodeof the substrateand the electrodeof the electronic componentand is used as a spacer.

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