The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2011
Filed:
Mar. 07, 2006
Applicants:
Koichi Nagai, Kyoto, JP;
Minoru Yamamoto, Hyogo, JP;
Ken Takano, Osaka, JP;
Tatsuo Sasaoka, Osaka, JP;
Kazumichi Shimizu, Osaka, JP;
Inventors:
Koichi Nagai, Kyoto, JP;
Minoru Yamamoto, Hyogo, JP;
Ken Takano, Osaka, JP;
Tatsuo Sasaoka, Osaka, JP;
Kazumichi Shimizu, Osaka, JP;
Assignee:
PANASONIC Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract
A plurality of film substrates () having a bare chip () mounted on one side or both sides are joined into a laminated state by joint portions () and are attached to a motherboard () through junction by a joint portion () at a location off the mounting areas of the bare chips (), thereby achieving a lower profile, higher lamination, and higher capacity.