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For the Inventor, By the Inventor

Plano, TX, United States of America

Tarak A Railkar

This inventor holds 30 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignees: Qorvo US, Inc., Maxim Integrated Products, Inc., National Technology & Engineering Solutions of Sandia, LLC. Active years: 2011-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tarak A Railkar. Retrieved from https://idiyas.com/inventor/tarak-a-railkar

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 30 

% Patents Active = 93.3

Average Co-Inventor Count = 2.8

ph-index = 6

Forward Citations = 153(Granted Patents)


Company Filing History:

goldMedal20 out of 1,235 
 
Qorvo US, Inc.
 patents
silverMedal4 out of 1,298 
 
Maxim Integrated Products, Inc.
 patents
bronzeMedal2 out of 1,089 
 
National Technology & Engineering Solutions of Sandia, LLC
 patents
4. 2 out of 233 
 
Triquint Semiconductor Corporation
 patents
5. 1 out of 1,813 
 
Avago Technologies General IP (Singapore) Pte. Ltd.
 patents
6. 1 out of 178 
 
Avago Technologies Wireless IP (Singapore) Pte. Ltd.
 patents
7. 1 out of 8 
 
Maxim Integrated Gmbh
 patents
where one patent can have more than one assignee

Years Active: 2011-2025

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Areas of Expertise:
Integrated Circuit Package
Thermal Management
Heat Spreader
Laminate Substrate
Sintered Components
Air-Cavity Package
Thermal Via Structures
Graphene Heat Dissipating
Multi-Layer Substrate
High-Power Devices
Die Attach Coatings
Thermally Enhanced Package
30 patents (USPTO):Explore Patents
1. 12327679 - Process for making laminate substrate with sintered components (2025-06-10),
2. 11929300 - Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) (2024-03-12),
3. 11783998 - Process for making laminate substrate with sintered components (2023-10-10),
4. 11626340 - Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) (2023-04-11),
5. 11551995 - Substrate with embedded active thermoelectric cooler (2023-01-10),
6. 10906274 - Laminate substrate with sintered components (2021-02-02),
7. 10587029 - Multi-layer substrate with integrated resonator (2020-03-10),
8. 10390434 - Laminate-based package with internal overmold (2019-08-20),
9. 10217686 - Air-cavity package with enhanced package integration level and thermal performance (2019-02-26),
10. 10177064 - Air cavity package (2019-01-08),
11. 10141245 - High-power acoustic device with improved performance (2018-11-27),
12. 10096536 - Graphene heat dissipating structure (2018-10-09),
13. 9991181 - Air-cavity package with enhanced package integration level and thermal performance (2018-06-05),
14. 9974158 - Air-cavity package with two heat dissipation interfaces (2018-05-15),
15. 9799637 - Semiconductor package with lid having lid conductive structure (2017-10-24),

Title: Inventor Tarak A Railkar - Pioneering Innovations in Plano

Introduction: Tarak A Railkar is a distinguished inventor based in Plano, Texas, known for his groundbreaking contributions to various technological fields.

Latest Patents: Tarak A Railkar holds several patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his versatility and ingenuity.

Career Highlights: With a career spanning over two decades, Tarak A Railkar has worked with leading research institutions and tech companies, consistently pushing the boundaries of innovation.

Collaborations: Throughout his career, Tarak A Railkar has collaborated with top engineers, scientists, and researchers, fostering a culture of creativity and excellence in all his projects.

Conclusion: Inventor Tarak A Railkar's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and entrepreneurs.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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