The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2021

Filed:

Aug. 16, 2019
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Tarak A. Railkar, Plano, TX (US);

Deepukumar M. Nair, Lake Mary, FL (US);

Jeffrey Dekosky, Winter Garden, FL (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C04B 35/468 (2006.01); B32B 18/00 (2006.01); C04B 35/581 (2006.01); C04B 35/47 (2006.01); C04B 35/10 (2006.01); B22F 1/00 (2006.01); B22F 7/04 (2006.01); C04B 41/50 (2006.01); C04B 41/87 (2006.01); H01L 29/94 (2006.01); H01F 17/00 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
B32B 18/00 (2013.01); B22F 1/0059 (2013.01); B22F 7/04 (2013.01); C04B 35/10 (2013.01); C04B 35/468 (2013.01); C04B 35/47 (2013.01); C04B 35/581 (2013.01); C04B 41/5036 (2013.01); C04B 41/87 (2013.01); H01L 29/945 (2013.01); H01F 17/0006 (2013.01); H01G 4/12 (2013.01);
Abstract

The present disclosure relates to a laminate substrate with sintered components. The disclosed laminate substrate includes a substrate body having an opening through the substrate body, a first foil layer, a sintered base component, and a sintered contact film. The first foil layer is formed underneath the substrate body, such that a first portion of the first foil layer fully covers the bottom of the opening. The sintered base component is formed within the opening and over the first portion of the first foil layer. Herein, the sintered base component has a dielectric constant between 10 and 500, or has a relative permeability greater than 5. The sintered contact film is formed over the sintered base component. The sintered base component is confined within the opening by the substrate body on sides, by the first foil layer on the bottom, and by the sintered contact film on the top.


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