The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Jan. 19, 2017
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Tarak A. Railkar, Plano, TX (US);

Kevin J. Anderson, Plano, TX (US);

Walid M. Meliane, Frisco, TX (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 23/00 (2006.01); H01L 23/04 (2006.01); H01L 23/10 (2006.01); H01L 25/00 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H01L 21/50 (2013.01); H01L 23/04 (2013.01); H01L 23/10 (2013.01); H01L 23/3675 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/17 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H05K 1/115 (2013.01); H05K 1/144 (2013.01); H05K 1/18 (2013.01); H05K 3/30 (2013.01); H05K 3/368 (2013.01); H05K 3/4697 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/19105 (2013.01); H05K 2201/042 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10674 (2013.01);
Abstract

The present disclosure relates to an air-cavity package, which includes a bottom substrate with a first heat dissipation interface, a top substrate with a second heat dissipation interface, a perimeter wall, a bottom electronic component, and a top electronic component. The perimeter wall extends between a periphery of the top substrate and a periphery of the bottom substrate to form a cavity. The bottom electronic component is mounted on the bottom substrate, exposed to the cavity, and thermally coupled to a bottom thermally conductive structure, which extends through the bottom substrate and towards the first heat dissipation interface. The top electronic component is mounted on the top substrate, exposed to the cavity, and thermally coupled to a top thermally conductive structure, which extends through the top substrate and towards the second heat dissipation interface.


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